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Lukas Gerlich
Lukas Gerlich
Atomic layer deposition
Inorganic chemistry
Materials science
Thin film
Titanium nitride
3
Papers
47
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Electrical property improvements of ultra low-k ILD using a silylation process feasible for process integration.
2011
IITC | International Interconnect Technology Conference
Oszinda Thomas
Matthias Schaller
Lukas Gerlich
Daniel Fischer
Susanne Leppack
Christin Bartsch
Stefan Schulz
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Citations (4)
Thermal ALD of Cu via reduction of Cu x O films for the advanced metallization in spintronic and ULSI interconnect systems
2011
Steve Mueller
Thomas Waechtler
Lutz Hofmann
André Tuchscherer
Robert Mothes
Ovidiu D. Gordan
Daniel Lehmann
Francisc Haidu
Marcel Ogiewa
Lukas Gerlich
Shao-Feng Ding
Stefan Schulz
Thomas Gessner
Heinrich Lang
D. R. T. Zahn
Xin-Ping Qu
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Citations (3)
Atomic Layer Deposition of Titanium Dioxide Thin Films from Cp*Ti(OMe)3 and Ozone
2009
Journal of Physical Chemistry C
Martin Rose
Jaakko Niinistö
Paweł Piotr Michałowski
Lukas Gerlich
Lutz Wilde
Ingolf Endler
Johann W. Bartha
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Citations (40)
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