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Haruki Ito
Haruki Ito
Epson
Materials science
Composite material
Electronic engineering
Chip
Electrical conductor
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半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
2011
Nobuaki Hashimoto
Haruki Ito
haruki itou
nobuaki hasimoto
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Resin Core Bump Technology
2009
Journal of Japan Institute of Electronics Packaging
Shuichi Tanaka
Hideo Imai
Haruki Ito
Nobuaki Hashimoto
Akira Makabe
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Development of Resin Stress Buffer Layer Type Wafer Level Chip Size Package with High Reliability for Board Level Test
2008
Journal of Japan Institute of Electronics Packaging
Nobuaki Hashimoto
Shuichi Tanaka
Shunpei Ogaya
Haruki Ito
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半導体装置、回路基板、電気光学装置および電子機器
2007
Yasuhito Ariga
Haruki Ito
Michiyoshi Takano
Ryohei Tamura
Shuichi Tanaka
haruki itou
taizin ariga
syuuiti tanaka
ryouhei tamura
dougi takano
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電子部品、回路基板、電子機器、電子部品の製造方法
2005
Nobuaki Hashimoto
Haruki Ito
haruki itou
nobuaki hasimoto
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