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S.M. Hosseini
S.M. Hosseini
Georgia Institute of Technology
Electronic engineering
Materials science
Microvia
Printed circuit board
Flip chip
2
Papers
13
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0
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Ultra-high density board technology for sub-100 /spl mu/m pitch nano-wafer level packaging
2003
EPTC | Electronics Packaging Technology Conference
Venky Sundaram
Fuhan Liu
A.O. Aggarwal
S.M. Hosseini
S. Mekala
George White
Rao Tummala
Madhavan Swaminathan
Woopoung Kim
R. Madhavan
G. Lo
M.K. Iyer
K. Vaidyanathan
E. H. Wong
Ranjan Rajoo
C. T. Chong
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Citations (2)
A novel technology for stacking microvias on printed wiring board
2003
ECTC | Electronic Components and Technology Conference
Fuhan Liu
George White
Venky Sundaram
A.O. Aggarwal
S.M. Hosseini
D. Sutter
Rao Tummala
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Citations (11)
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