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S. Mekala
S. Mekala
Georgia Institute of Technology
Electronic engineering
Materials science
Microvia
Flip chip
Interconnection
2
Papers
7
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0
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Ultra-high density board technology for sub-100 /spl mu/m pitch nano-wafer level packaging
2003
EPTC | Electronics Packaging Technology Conference
Venky Sundaram
Fuhan Liu
A.O. Aggarwal
S.M. Hosseini
S. Mekala
George White
Rao Tummala
Madhavan Swaminathan
Woopoung Kim
R. Madhavan
G. Lo
M.K. Iyer
K. Vaidyanathan
E. H. Wong
Ranjan Rajoo
C. T. Chong
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Citations (2)
Fabrication of ultra-fine line circuits on PWB substrates
2002
ECTC | Electronic Components and Technology Conference
Fuhan Liu
Venky Sundaram
S. Mekala
George White
D. Sutter
Rao Tummala
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Citations (5)
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