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Hideaki Nagaoka
Hideaki Nagaoka
Fujitsu
Materials science
Substrate (chemistry)
Composite material
Printed circuit board
Thermal
5
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2
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Thermal Warp Simulation in Substrate with Properties Change of Curing Resin
2019
Hideaki Nagaoka
Masaharu Furuyama
Tomoyuki Akahoshi
Daisuke Mizutani
Seiki Sakuyama
Mami Nagatake
Nobutaka Itoh
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Simulation Approach to Predict Warpage based on Resin Curing Behavior during Substrate Manufacturing Process
2018
EPTC | Electronics Packaging Technology Conference
Masaharu Furuyama
Hideaki Nagaoka
Tomoyuki Akahoshi
Daisuke Mizutani
Seiki Sakuyama
Mami Nagatake
Nobutaka Itoh
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Thermal Stress Simulation Method in Substrate with Cure Shrinkage Reaction of Thermosetting Resin
2018
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Hideaki Nagaoka
Masaharu Furuyama
Tomoyuki Akahoshi
Daisuke Mizutani
Seiki Sakuyama
Mami Nagatake
Nobutaka Itoh
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Viscoelastic analysis of multistage stacked via structure in build-up substrate
2016
ICEP | International Conference on Electronics Packaging
Hideaki Nagaoka
Tomoyuki Akahoshi
Masaharu Furuyama
Daisuke Mizutani
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Simulation of differential skew considering fiber kink effects
2014
ICSJ | CPMT Symposium Japan
Taiga Fukumori
Hideaki Nagaoka
Daisuke Mizutani
Motoaki Tani
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