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Thermal Warp Simulation in Substrate with Properties Change of Curing Resin
Thermal Warp Simulation in Substrate with Properties Change of Curing Resin
2019
Hideaki Nagaoka
Masaharu Furuyama
Tomoyuki Akahoshi
Daisuke Mizutani
Seiki Sakuyama
Mami Nagatake
Nobutaka Itoh
Keywords:
Thermal
Substrate (chemistry)
Composite material
Curing (food preservation)
Materials science
Correction
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