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Stefania Rinaldi
Stefania Rinaldi
STMicroelectronics
Bending
Composite material
Thinning
Metallurgy
Wafer
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An Approach to Predict 4H-SiC Wafer Bending after Back Side Thinning by Substrate Resistivity Analysis
2020
Materials Science Forum
Nicolò Piluso
Stefania Rinaldi
Simona Lorenti
Anna Bassi
Andrea Severino
Salvo Coffa
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