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Sharon Lim Ps
Sharon Lim Ps
Agency for Science, Technology and Research
Materials science
Wafer-level packaging
Electronic engineering
Fan-out
Fabrication
5
Papers
64
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A Study to Reduce Molding Film Defects During Vacuum Lamination Process
2020
EPTC | Electronics Packaging Technology Conference
Lau Boon Long
David Ho
Sharon Lim Ps
Chai Tai Chong
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Fan-Out Wafer Level Packaging Development Line
2020
EPTC | Electronics Packaging Technology Conference
T. C. Chai
David Ho
S. C. Chong
Hsiang-Yao Hsiao
Serine Soh
Simon Siak Boon Lim
Sharon Lim Ps
Eva Wai
Boon Long Lau
Wen Wei Seit
Guan Kian Lau
Phua Ts
Keith Cheng Sing Lim
Sharon Lim Sh
Yong Liang Ye
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Process Development of Fan-Out interposer with Multi-layer RDL for 2.5D System in Package
2018
EPTC | Electronics Packaging Technology Conference
Hsiao Hsiang Yao
David Ho Soon Wee
Simon Siak Boon Lim
Ser Choong Chong
Sharon Lim Ps
Chai Tai Chong
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Citations (1)
Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package
2017
ECTC | Electronic Components and Technology Conference
Vempati Srinivasa Rao
Chai Tai Chong
David Ho
Ding Mian Zhi
Chong Ser Choong
Sharon Lim Ps
Daniel Ismael
Ye Yong-liang
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Citations (12)
Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications
2016
ECTC | Electronic Components and Technology Conference
Vempati Srinivasa Rao
Chai Tai Chong
David Ho
Ding Mian Zhi
Chong Ser Choong
Sharon Lim Ps
Daniel Ismael
Yuanyuan Liang
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Citations (51)
1