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Shunqiang Gong
Shunqiang Gong
GlobalFoundries
Electronic engineering
Supply chain
Chip
Die (manufacturing)
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2.5D packaging solution — From concept to platform qualification
2015
EPTC | Electronics Packaging Technology Conference
Jens Oswald
Christian Goetze
Shan Gao
Shunqiang Gong
Juan Boon Tan
Rick Reed
Youngrae Kim
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