2.5D packaging solution — From concept to platform qualification

Silicon interposers offer a viable path to perpetuating the trend of increased chip performance per die area, as projected by Moore's law, which can no longer be met by simply shrinking feature sizes. The enablement of such packaging solutions not only requires new processes for Through Silicon Vias (TSV), thin die manufacturing, assembly and test, but also a well-defined concept of process and supply chain. In a joint work between GLOBALFOUNDRIES and Amkor Technology, a test vehicle with focus on processing aspects and chip package interaction (CPI) has been designed, manufactured, tested, and stressed. The findings and data have been used for the definition of a common interposer platform, now available for customers. This paper describes the design and manufacturing concept of the test vehicle, discusses challenges for interposer processing and test, and shares reliability results.