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Arman Nokhosteen
Arman Nokhosteen
K.N.Toosi University of Technology
Electronic engineering
Principal component analysis
Boundary value problem
Heat transfer
Integrated circuit
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Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
2019
Journal of Electronic Packaging
Arman Nokhosteen
M. Soltani
Banafsheh Barabadi
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