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Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
2019
Arman Nokhosteen
M. Soltani
Banafsheh Barabadi
Keywords:
Electronic engineering
Principal component analysis
Boundary value problem
Heat transfer
Integrated circuit
Engineering
Finite element method
Mechanical engineering
Thermal conductivity
computer software
transient heat transfer
Physics
reduced order
Correction
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