Old Web
English
Sign In
Acemap
>
authorDetail
>
Hsiang-En Ding
Hsiang-En Ding
Industrial Technology Research Institute
Wafer-level packaging
Materials science
Optoelectronics
Three-dimensional integrated circuit
Chip
3
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A novel multi-chip stacking technology development using a flip-chip embedded interposer carrier integrated in fan-out wafer-level packaging
2021
ECTC | Electronic Components and Technology Conference
Yu-Min Lin
Wei-Lan Chiu
Chao-Jung Chen
Hsiang-En Ding
Ou-Hsiang Lee
Lin Ang-Ying
Ren-Shin Cheng
Sheng-Tsai Wu
Tao-Chih Chang
Hsiang-Hung Chang
Wei-Chung Lo
Chia-Hsin Lee
Jennifer See
Baron Huang
Xiao Liu
Te Pei Hsiang
Chang-Chun Lee
Show All
Source
Cite
Save
Citations (0)
Versatile laser release material development for chip-first and chip-last fan-out wafer-level packaging
2021
ECTC | Electronic Components and Technology Conference
Chia-Hsin Lee
Baron Huang
Jennifer See
Xiao Liu
Yu-Min Lin
Wei-Lan Chiu
Chao-Jung Chen
Ou-Hsiang Lee
Hsiang-En Ding
Ren-Shin Cheng
Lin Ang-Ying
Sheng-Tsai Wu
Tao-Chih Chang
Hsiang-Hung Chang
Kuan-Neng Chen
Show All
Source
Cite
Save
Citations (0)
1