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Chao-Jung Chen

Industrial Technology Research Institute

15

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42

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A novel multi-chip stacking technology development using a flip-chip embedded interposer carrier integrated in fan-out wafer-level packaging

2021 ECTC | Electronic Components and Technology Conference
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Versatile laser release material development for chip-first and chip-last fan-out wafer-level packaging

2021 ECTC | Electronic Components and Technology Conference
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The set up of primary calibration system for shock acceleration in NML

2012 Measurement
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TWO SHOCK MACHINE SIMULATIONS PRESTUDY FOR PRIMARY LOW LEVEL SHOCK CALIBRATION SYSTEM

2009
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Development of a 2-axis Closed Loop Micro-/Nano-Positioning Stage Embedded with 2 Fiber Optical Interferometer Systems

2008
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Stage Equipped with Single Actuator for Nano-Positioning in Large Travel Range

2007 Key Engineering Materials
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Pitch Calibration by an Active Temperature Controlled Traceable Atomic Force Microscope and a Laser Diffractometer

2005 Key Engineering Materials
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Method for continuous end standard measurement utilizing laser interferometer

2004
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Pitch calibration by reflective laser diffraction

2003
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Study of Asymmetrical Cold-and-Hot Rolling of Three-Layer Bounded Clad Sheet

2003 Key Engineering Materials
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