Old Web
English
Sign In
Acemap
>
authorDetail
>
Silvia Hertel
Silvia Hertel
Chemnitz University of Technology
Reactive bonding
Materials science
Electroplating
Ceramic
Isotropic etching
2
Papers
6
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Electroplating of Pd/Sn Multilayers for Reactive Bonding in Packaging and Assembly Applications
2020
ESTC | Electronics System-integration Technology Conference
Silvia Hertel
Klaus Vogel
Maik Wiemer
Thomas Otto
Show All
Source
Cite
Save
Citations (2)
Assembly and packaging of micro systems by using reactive bonding processes
2015
EMPC | European Microelectronics and Packaging Conference
Axel Schumacher
Ulrike Gaiß
Stephan Knappmann
Georg Dietrich
Stefan Braun
Erik Pflug
Frank Roscher
Klaus Vogel
Silvia Hertel
Dirk Kähler
Wolfgang Reinert
Show All
Source
Cite
Save
Citations (4)
1