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Steven Hsu
Steven Hsu
TSMC
Materials science
Composite material
Wafer
Delamination
Automotive engineering
3
Papers
5
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0
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2024
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The Analysis for Bump Resistance Improvement by Optimizing the Sputter Condition
2019
ECTC | Electronic Components and Technology Conference
Ming-Sin Su
Chang-Ning Wang
Clair Tsai
T. L. Yang
Rolance Yang
W.C. Wu
C. S. Liu
J. M. Chiu
Y. F. Chen
Ponder Pang
Harry Ku
Kirin Wang
C. H. Su
Steven Hsu
Calvin Lu
K. C. Liu
Marvin Liao
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Citations (1)
WLCSP Package and PCB Design for Board Level Reliability
2019
ECTC | Electronic Components and Technology Conference
Jason Chiu
Kuo-Chin Chang
Steven Hsu
Pei-Haw Tsao
M. J. Lii
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Citations (4)
A Novel Metal Scheme and Bump Array Design Configuration to Enhance Advanced Si Packages CPI Reliability Performance by Using Finite Element Modeling Technique
2019
ECTC | Electronic Components and Technology Conference
Kuo-Chin Chang
Mirng-Ji Lii
Steven Hsu
Hao-Chun Liu
Yen-Kun Lai
Sheng-Han Tsai
Chieh-Hao Hsu
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