Effect of T-shaped fin arrangements on the temperature control performance of a phase change material heat sink
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Phase-change material
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Reduction of thermal resistance of naturally-cooled cooling system has been investigated. Pin-fin type heat sink was utilized as to clarify the effect of pin arrangement on the thermal performance of heat sink. The pitch of fins was set 1, 2, 3, 4, 5mm where the surface area of all heat sink was set as the same. The results show that the thermal resistance of heat sink decreases with increasing pitch of fin arrangement from 1 to 4mm, whereas the thermal resistance gets increase when the pitch was set 5mm. The results also show that even the slight decrease in fin efficiency causes the increase in the thermal resistance.
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The ongoing development of faster and smaller electronic components has led to a need for new technologies to effectively dissipate waste thermal energy. The pulsating heat pipe (PHP) shows potential to meet this need, due to its high heat flux capacity, simplicity, and low cost. A 20-turn flat plate PHP was integrated into an aluminum flat plate heat sink with a simulated electronic load. The PHP heat sink used water as the working fluid and had 20 parallel channels with dimensions 2 mm × 2 mm × 119 mm. Experiments were run under various operating conditions, and thermal resistance of the PHP was calculated. The performance enhancement provided by the PHP was assessed by comparing the thermal resistance of the heat sink with no working fluid to that of it charged with water. Uncharged, the PHP was found to have a resistance of 1.97 K/W. Charged to a fill ratio of approximately 75% and oriented vertically, the PHP achieved a resistance of .49 K/W and .53 K/W when the condenser temperature was set to 20°C and 30°C, respectively. When the PHP was tilted to 45° above horizontal the PHP had a resistance of .76 K/W and .59 K/W when the condenser was set 20°C and 30°C, respectively. The PHP greatly improves the heat transfer properties of the heat sink compared to the aluminum plate alone. Additional considerations regarding flat plate PHP design are also presented.
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Sink (geography)
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Improving the performance of the computers and maintaining the operating temperature is an important task for the computer hardware manufacturers. The junction temperature of the electronic components is a critical problem which needs to be addressed in a competent way. Due to the improvement in the technology, the size and weight of the electronic components reduced to a greater extent and which in turn increases the operating power and speed. This increases the heat generated by the electronic component. Electronic components normally use conventional rectangular fin as heat sink for the step up in heat transfer. The need is to make a heat sink design that should overcome the problem related to transfer of heat by the electronic components. The heat transfer depends on parameters like heat sink’s surface area, pitch, design and material used. Optimization of the fin design by number of experiments is more expensive and laborious as well. CFD (Computational Fluid Dynamics) simulation validated with experimentation can be a good alternative for performing series of experiments. CFD modeling and simulation for the best fin design has been carried out for the current study. An alternative design for conventional rectangular fin has been proposed for this study called as Extruded Rectangular Fin (ERF). The proposed ERF shows good heat transfer when compared to conventional and interrupted rectangular fin with holes. Optimum cooling achieved for the system with the fin aspect ratio of 3.5.
Fin
Electronic component
Electronics cooling
Heat transfer enhancement
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The heat sink has played an important role in the thermal design of high power LED lamps. In this study, a pin-fin heat sink is designed for the 3-chips high power LED down-light. Thermal performance of pin-fin heat sink is researched by changing the fin height, fin number and lamp’s irradiation angle. Simulation results gotten by CFD software show that the pin-fin heat sink has better thermal performance with fin height of 40mm and fin number of 75. The LED down-light with a pin-fin heat sink has a better cooling effect in multi-angle irradiation. The results provide a reference for future design of pin-fin heat-sink.
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This paper provided a new type vapor chamber coupled fin heat sink, which is applied to high power LED light source. It shows good performance for the heat dissipation of high power LED devices. To compare its performance, the same LED light source with only fin heat sink was also fabricated and tested. Experimental tests, numerical simulation and thermal resistance analysis were conducted on the two prototypes. The basic principle of vapor chamber, the experiment set-up and the detailed comparisons between the simulated results and the tests results were also presented in this paper. The results showed that the vapor chamber coupled fin heat sink could make the temperature of the fin base plate uniform, the thermal resistance of vapor chamber was as low as 0.05K/W. The fin heat sink assembled on vapor chamber demonstrated good heat removal capacity, indicating an overall thermal resistance of 0.654K/W at the ambient temperature of 27°C.
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As socketable LED modules are being developed the need for thermal characterization of heat-sinks aimed at cooling such modules has also arisen. The natural approach from manufacturers is to apply the component level LED thermal testing standards to characterize complete LED module and heat-sink systems. In order to obtain the real thermal resistance of such a complete assembly needs the consideration of the radiant power of the LEDs when calculating the thermal resistance of the complete assembly. Also, the contribution of the LED module, the thermal interface between the module and the heat-sink and the thermal resistance of the heat-sink need to be separated. For the latter problem thermal transient measurements followed by structure function analysis is a solution. To eliminate the need for the measurement of radiant flux of the LED module we suggest building a thermal dummy of the module in question which mechanically is compatible with the module but the heat source is a conventional silicon device instead of LEDs. The paper provides details how such a thermal dummy was created and used in characterizing different heat-sinks aimed at a particular LED module family.
Thermal grease
Transient (computer programming)
LED lamp
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By an analysis of the operation of heat sink,a new method is proposed for the calculation of thermal resistance for air-cooling heat sink of power semiconductor parts.For the calculation,there are 2 steps: internal heat transmission and the surface heat diffusion.The basic formulae for each step are provided,and the results are verified by using the heat sink thermal resistance curve provided by the manufacturer.The calculation result shows that this method is easy and accurate.
Sink (geography)
Heat transmission
Passive cooling
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For thermal management, power electronic devices are typically mounted on a heat sink with a thermal interface material (TIM) between the device tab and heat sink for the purpose of electrical isolation. Different thermal interface materials are available. The device can be mounted on to the heat sink with a screw or a special mounting clamp. Over the thermal resistances of the device, interface material and heat sink, the contact thermal resistances are also significant, but are challenging to be quantified. This paper presents experimental studies to evaluate the thermal resistance between the device junction and the heat sink, considering different thermal interface materials and different clamps at different mounting torques of the fastening screw. The device power dissipation, on state resistance and heat sink temperature are measured. Since the junction temperature cannot be measured directly, a procedure to estimate the same based on measured on-state resistance is presented. The experimental arrangement and techniques are reported along with comparative results for different mounting arrangements.
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This paper describes the results of a computational investigation of the thermal performance of chip scale package arrays with various low profile heat sinks. The arrays considered were fully populated with both modules and heat sinks. The heat sinks used in any single array were identical. The parameters evaluated included module spacing, cooling air inlet velocity, per module power dissipation, and heat sink design. The heat sinks fell into two categories: the plate and the block. A plate was defined as a single continuous piece of material covering all of the modules in the array. The block heat sinks were individual pieces of material that were affixed to each module and were not physically connected to the other heat sinks in the array. The results of this study are presented as thermal resistances for each module in the array. Also considered, for some specific cases, are the heat transfer coefficients for each heat sink as a function of its position within the array. Interesting results included the changing of the shape of the resistance curve with changes in heat sink design. Also noted was the relationship between the thermal resistance of a module and the heat transfer coefficient for the top surface of that heat sink. Related to this were the changes in thermal resistance due to changes in the material properties used in the modules and how this affected the heat flow within the array.
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