Heat Transfer Analysis of Extruded Rectangular Fin over Conventional Rectangular Fins by Numerical Simulation
1
Citation
6
Reference
10
Related Paper
Citation Trend
Abstract:
Improving the performance of the computers and maintaining the operating temperature is an important task for the computer hardware manufacturers. The junction temperature of the electronic components is a critical problem which needs to be addressed in a competent way. Due to the improvement in the technology, the size and weight of the electronic components reduced to a greater extent and which in turn increases the operating power and speed. This increases the heat generated by the electronic component. Electronic components normally use conventional rectangular fin as heat sink for the step up in heat transfer. The need is to make a heat sink design that should overcome the problem related to transfer of heat by the electronic components. The heat transfer depends on parameters like heat sink’s surface area, pitch, design and material used. Optimization of the fin design by number of experiments is more expensive and laborious as well. CFD (Computational Fluid Dynamics) simulation validated with experimentation can be a good alternative for performing series of experiments. CFD modeling and simulation for the best fin design has been carried out for the current study. An alternative design for conventional rectangular fin has been proposed for this study called as Extruded Rectangular Fin (ERF). The proposed ERF shows good heat transfer when compared to conventional and interrupted rectangular fin with holes. Optimum cooling achieved for the system with the fin aspect ratio of 3.5.Keywords:
Fin
Electronic component
Electronics cooling
Heat transfer enhancement
Novel flow channel configurations in heat sinks for electronics cooling were proposed in this paper. Computational analyses were carried out to better understand the heat transfer performance, the uniformity of temperature fields of the heat sinking surface, as well as the pressure losses and pumping power in the operation of heat sinks. Comparison of the overall performance regarding to temperature uniformity on the heat sink surface and pumping power consumption was made for heat sinks having novel flow channel configurations and having traditional flow channel configurations. It has been found that the novel flow channel configuration dramatically reduces the pressure loss in the flow field. Giving the same pumping power consumption of an electronics cooling process, the temperature difference on surface of the heat sink which has novel flow channel configuration can be much lower than that of the heat sinks which have traditional flow channel configurations.
Electronics cooling
Cite
Citations (3)
One of the most significant reasons for thermal defects in electronic systems is having high temperature areas on an electronic printed circuit board caused by multiple heat sources placed in a cluster. The current research focuses on characterizing thermally two possibilities of cooling such areas, one by employing individual heat sinks for each component in the cluster and another with having one heat sink to dissipate the temperature from all components at once. It has been shown that using individual heat sinks for each component has a significant impact on the overall temperature of the system, reducing the temperature with approximately 20 °C, in steady-state conditions. Individual heat sinks can be integrated in all electronic systems where high-power component clusters are used.
Electronic component
Component (thermodynamics)
High heat
Sink (geography)
Passive cooling
Cite
Citations (0)
Abstract High porosity metal foams offer large surface area per unit volume and have been considered as effective candidates for convection heat transfer enhancement, with applications as heat sinks in electronics cooling. In this paper, the research progress in thermohydraulic performance characterization of metal foams and their application as heat sinks for electronics cooling are reviewed. We focus on buoyancy-induced convection, forced convection, flow boiling, and solid/liquid phase change using phase change materials (PCMs). Under these heat transfer conditions, the effects of various parameters influencing the performance of metal foam heat sink are discussed. It is concluded that metal foams demonstrate promising capability for heat transfer augmentation, but some key issues still need to be investigated regarding the fundamental mechanisms of heat transfer to enable the development of more efficient and compact heat sinks.
Electronics cooling
Forced convection
Computer cooling
Passive cooling
Heat transfer enhancement
Enhanced heat transfer
Cite
Citations (41)
Microchannel
Electronics cooling
Computer cooling
Cite
Citations (1)
Since the last decade, researchers have mainly focused on developing a heat transfer device which has high specific heat transfer. In order to do that, heat sinks were made which have high specific heat transfer compared to other heat transfer devices. It is a type of heat exchanger which is used to extract heat from electronic devices. Heat sinks are very cost effective, reliable, and very easy to handle. For increasing the heat transfer rate, different shapes and arrangements of extended surface, that is fins, were placed on the heat sink. In order to understand the nature of heat transfer through heat sinks and to understand the different process parameters, a review of heat sinks is necessary. Here, in this work, a complete review of heat sinks is done.
NTU method
High heat
Cite
Citations (0)
Piezoelectric fans have been investigated for electronics cooling over the last decade. The primary usage or method has been to place the vibrating fan near the surface to be cooled. The piezofan used in the current study is composed of a piezo actuator attached to a flexible metal beam. It is operated at up to 120VAC and at 60 Hz. While most of the research in the literature focused on cooling bare surfaces, larger heat transfer rates are of interest in the present study. A proposed system of piezoelectric fans and heat sink is presented as a more efficient method of system cooling with these fans. In this paper, a heat sink and piezoelectric fan system demonstrated a capability of cooling an area of about 75 cm2 (about 1 C/W) where electronic assemblies can be mounted. The heat sink not only provides surface area, but also flow shaping for the unusual three-dimensional flow field of the fans. A volumetric coefficient of performance (COPv) is proposed, which allows a piezofan and heat sink system volume to be compared against the heat dissipating capacity of a similar heat sink of the same volume for natural convection. A piezofan system is shown to have a COPv of five times of a typical natural convection solution. The paper will further discuss the effect of nozzles in flow shaping obtained via experimental and computational studies. A three-dimensional flow field of the proposed cooling scheme with a piezofan is obtained via laser Doppler anemometry (LDA) flow visualization method. Velocities at the heat sink in the order of 1.5 m/s were achieved through this critical shaping. Finally, the overall system characterization to different heat loads and fan amplitudes will be discussed.
Electronics cooling
Passive cooling
Cite
Citations (9)
The reliability of electronic components is affected critically by the temperature at which the junction operates. As operating powers and speed increase, and as designers are forced to reduce overall system dimensions, the problems of extracting heat and controlling temperature can become crucial. The continuing increase of power densities in electronics packages and the simultaneous drive to reduce the size and weight of electronic products have led to an increased importance on thermal management issues in this industry. Plate fin heat sinks are commonly used devices for enhancing heat transfer in electronics components.. The choice of an optimal heat sink depends on a number of geometric parameters such as fin height, fin length, fin thickness, number of fins, base plate thickness, space between fins, fin shape or profile, material etc. Given a set of design constraints, one needs to determine the maximum possible performance of a heat sink within the constraints. Optimizing the above parameters to achieve low thermal resistance and low pressure drop is very difficult. In order to select the optimal geometric parameters of a heat sink for a particular application, a designer requires
Fin
Electronics cooling
Sink (geography)
Cite
Citations (27)
Electronics cooling
Microelectronics
Cite
Citations (30)
Thermal management of electronic devices has emerged as a very important issue for the reliability and long term operation of these devices or equipments.Tremendous efforts are given to the optimization of heat sinks which dissipate waste heat from these devices.However,the role of a base in a heat sink is seldom analyzed.In this investigation,throughout detailed numerical calculations with a nondimensionalized three dimensional heat transfer model,the possible optimal thickness of a base is explored with different convective heat transfer boundary conditions.From the calculations with the validated numerical solution,the relations among the heat transfer mechanisms,the area ratios of a heat sink to a heating source,and the lowest thermal resistance is obtained and discussed.Also a simple correlation for these three parameters from data fitting is given for guiding the heat sink design.
Electronics cooling
Passive cooling
Cite
Citations (0)
A heat sink is a single component or an assembly which is capable of transferring the heat generated within a solid material to a fluid medium such as air or liquid. Heat exchangers in refrigeration and air-conditioning systems act as heat sinks, and car radiator is another example of a heat sink. Heat sinks also play a vital role in the field of electronics by cooling optoelectronic devices such as higher-power lasers and Light Emitting Diodes (LEDs). The present paper aims to add to the knowledge of the fundamentals of single phase flow heat transfer in perforated plate heat sink, thereby aiding in the development of this new and interesting technology. The main part of the present investigation concerns with the effect of having and not having an array of tubes on the overall thermal performance of the heat sink. Experimental work was done for analyzing the heat transfer through a compact perforated heat sink comprising a base plate having an array of tubes projecting from the base plate with one or more holes drilled in the sidewall adjacent to the bottom of each tube, creating a chimney effect by the upward draft of air flow through the tubes. The heat sink was heated by a plate heater, and temperatures were measured at the inlet and outlet positions. The obtained results are very useful for application of Claude-cycle cryogenic refrigerators.
Radiator (engine cooling)
Heat transfer enhancement
Thermal grease
Cite
Citations (2)