Molecular structure and dynamics of water on the surface of cement hydration products: Wetting behavior at nanoscale
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基板の表面に液滴を置くと, 液滴が有限の接触角をもったレンズになる場・合 (部分濡れ : Partial Wetting) と基板の表面に均一に拡がる場合 (濡れ : Complete Wetting) のいずれかが観察される。この二つの状態が, Youngの式や平衡拡張係数を使って区別できることはよく知られているが, 部分濡れ状態をミクロスコピックに見ると, 基板上に液体が全く拡がっていない状態 (非濡れ : Non-Wetting) と分子レベルの厚みをもった薄膜がレ・ンズと共存している状態 (薄膜 : Pseudo-Partial Wetting) が存在することや, 薄膜状態を含めて濡れ状態を分類する方法はあまり知られていない。本稿では, アルカンレンズの水溶液表面での濡れを例として, まず, 初期拡張係数と表面問力の組み合わせによって三つの濡れ状態を分類する方法を紹介し, 次に, 異なる濡れ状態の問での転移現象がこれらの変数のどのような変化に基づいて起こるのかを説明する。また, 本稿の最後では, このような一般的な分類とは別に, アルカン薄膜が界面活性剤水溶液上に形成されている場合にのみ観察される特異な現象としてアルカン薄膜の液体-固体状態転移とその形成機構に関する説明を行う。
Wetting transition
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Wetting transition
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Wettability is a tendency for one fluid to spread on or adhere to a solid surface in the presence of other immiscible fluids.The can improve gas recovery of condensate reservoir,its mechanism is by altering the wettability of wellbore region from liquid-wetting to gas-wetting to improve the gas recovery.Also studies some methods of wettability,such as contact-angle method,the Amott method and USBM method,analyzes the characteristic of these methods,and proposes several quantitative methods for gas-wetting,finally summarizes the development trend of the gas-wetting.
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The wetting angles of various metals and their alloys were determined by high temperature sessile drop method. The results indicate that the wettability of Cu, Fe, Co, Ni and Fe-Cr alloy on TiO surface is not good, and the contact angles are 48°~120° at melting point temperature; Cu on TiO surface is non-reaction wetting, and the others are reaction wetting. But the wettability can be improved by adding some surfactant. The wettability of Cu on TiO surface can be improved effectively by adding more than 2%Mo_2C, and at the same time the non-reaction wetting is changed into reaction wetting. The wettability of Fe-Cr alloy on TiO surface can be improved markedly by adding more than 1.5%Mn or 1.5%Si; the wetting type is not changed by adding Mn, but the reaction wetting is changed into non-reaction wetting by adding Si.
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In this work, we investigate the effects of 0.1 and 0.5 wt.% Al additions on the wettability of Sn-1Ag-0.5Cu solder on a Cu substrate. Spread area and wetting balance methods were used to evaluate the wettability of the solders. The results of both tests show that the addition of 0.1 wt.% Al does slightly improve the wetting properties of the Sn-1Ag-0.5Cu solder, whereas the addition of 0.5 wt.% Al worsens the wetting properties.
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The wetting behavior of SiC by molten Al and Al-Mg alloys using the sessile-drop testing equipment was investigated. The results showed that Mg has a remarkable influence on the wettability and reaction in the Al/SiC system. The contact angle between SiC substrate and molten Al-Mg alloys decreased more quickly with increasing of Mg content. The transition temperature from non-wetting to wetting dropped with increasing of Mg content, suggesting that the addition of Mg does promote the wettability of SiC by molten Al. The role of the Mg addition on the wetting was presumably attributed to its deoxidation as well as the inhibition of the interfacial reaction between Al and SiC.
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Autophobicity or pseudo partial wetting, a phenomenon of a liquid not spreading on its own monolayer, is characterized by an energy barrier that prevents the growth of a wetting film beyond the monolayer thickness, which additionally may have an impact on the conditioning performance of films.
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