ChemInform Abstract: DIE REINHEIT DER ENANTIOMEREN VON PHENYLAETHYLENGLYKOL, DIE ASYMMETRISCHE RED. VON PHENYLGLYOXYLATEN IM ZUSAMMENHANG MIT STRUKTURZUORDNUNGEN
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Abstract Im Zusammenhang mit der Zuordnung absoluter Strukturen werden verschiedene Reduktionsreaktionen erneut untersucht.Cite
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Higher density interconnection using 3-Dimensional technology implies a pitch reduction and the use of micro-bumps. The micro-bump size reduction has a direct impact on the placement accuracy needed on the die placement and flip chip bonding equipment. The paper presents a Die-to-Die and Die-to-Wafer, high accuracy, die bonding solution illustrated by the flip chip assembly of a large 2x2cm die consisting of 1 million 10 μm micro-bumps at 20 μm pitch
Wafer Bonding
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The original is aimed at appearance of nealy failure for warm extrusion die in high temperature and high pressure, inquirement and dissecing the element that the die early failure was come into being, through die designing 、die material 、die cooling and die lubricates the respects propose to the countermove.
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Split combination female die was used in flexible die system for radial die parting axial extrusion for taking out the work form female die more easily.The quick assembling/disassembling combined male die was used to make easy the die replacing and prolong the life-span of die.For only the female and male die segment need to be changed,so it lowers the cost of die,saves the time for die-changing,increases productivity and accelerates enterprise's response to the market.
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The technology of designing and making for extrusion die with small die-mandrel by several examples is introduced.
Mandrel
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The full utilization of the active devices within a SiC power module can be limited by the common stray inductive path imposed by the substrate layout. In this paper, the prospect of integrating individual gate bulfers per power die is explored for lowering the total losses of a power module, while maintaining a good thermal distribution across the set of dies. Each die within the power module has an increased utilization due not only having lowered losses, but due to the similar source inductive path for die, similar thermal loading. Using a 50kVA, 1.2kV, 8-die prototype power module, the overall switching losses using per-die bulfers is found to be reduced by a factor of 25%, while significantly improving the thermal distribution from die to die.
Power module
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Ring oscillator
Process Variation
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Die attach process is widely used to realize the connection between die, device and the rest of the system in electronic packaging. During this process, the die moves under the capillary force induced by the liquidus solder. Such a die tilt phenomenon usually occurs and strongly worsens the reliability and performances of devices. In this paper, we built a numerical model based on fluid minimal free energy theory for analyzing the die arrangement in die attach process. By this model, die arrangements of three kinds of die shapes in terms of square, square with round corner and circle were calculated. Results indicate that compared to the square, both square with round corner and circle benefit preventing the die tilt. Especially, the circle die can well keep the parallel die arrangement.
Square (algebra)
Die casting
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