Vision systems for PCB manufacturing in Japan
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Abstract:
Current vision systems in Japanese printed circuit board (PCB) manufacturing lines are described. Vision systems have been introduced into almost every level of PCB manufacturing in Japan. They include mask pattern inspection machines, PCB pattern inspection machines, surface-mount device (SMD) mounters with visual positioning, mounted SMD visual inspection machines, soldering inspection machines, and assembled PCB visual inspection machines. Most of these vision systems were integrated successfully and achieved significant benefits. Rapid development of SMDs necessitated the development of new types of mounters and visual inspection systems.< Keywords:
Visual inspection
Automated optical inspection
Machine Vision
Surface-mount technology
SMT placement equipment
Automated X-ray inspection
3d printed
Automated visual inspection (AVI) is becoming an integral part of modern surface mount technology (SMT) assembly process. This high technology assembly, produces printed circuit boards (PCB) with tiny and delicate electronic components. With the increase in demand for such PCBs, high-volume production has to cater for both the quantity and zero defect quality assurance. The ever changing technology in fabrication, placement and soldering of SMT electronic components have caused an increase in PCB defects both in terms of numbers and types. Consequently, a wide range of defect detecting techniques and algorithms have been reported and implemented in AVI systems in the past decade. Unfortunately, the turn-over rate for PCB inspection is very crucial in the electronic industry. Current AVI systems spend too much time inspecting PCBs on a component-by-component basis. In this paper, we focus on providing a solution that can cover a larger inspection area of a PCB at any one time. This will reduce inspection time and increase the throughput of PCB production. Our solution is targeted for missing and misalignment defects of SMT devices in a PCB. An alternative visual inspection approach using color background subtraction is presented to address the stated defect. Experimental results of various defect PCBs are also presented.
Automated optical inspection
Surface-mount technology
Visual inspection
Component (thermodynamics)
Electronic component
SMT placement equipment
Automated X-ray inspection
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Automated X-ray inspection
Visual inspection
Component (thermodynamics)
Scale-invariant feature transform
Automated optical inspection
SMT placement equipment
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This paper presents an inspection system for the defects on surface mounted device (SMD) printed circuit boards (PCBs). There are five types of defects, namely, missing component, misalignment, wrong orientation of IC chip, wrong parts and poor solder joints. Thus, different algorithms are developed to detect these faults. Vision system has been introduced into almost every level of PCB manufacturing. They include PCB pattern inspection machines, SMD mounter with visual positioning, mounted SMD visual inspection machines, soldering inspection machines, assembled PCB visual inspection machines etc. Most of these vision systems are integrated successfully and achieve significant benefits. But the rapid development of surface mounted technology makes precision SMD mounters and visual inspection machines become necessary. Efforts are being made to develop precision SMD mounters and solder inspection systems.
Automated optical inspection
Visual inspection
Automated X-ray inspection
Machine Vision
Surface-mount technology
SMT placement equipment
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Purpose To present an overview of the research and development carried out by an EC Framework 6 part funded consortium, known as MICROSCAN, for the implementation of an in‐line PCB inspection prototype system that is capable of offering comprehensive defect detection. Design/methodology/approach Four non‐destructive testing inspection modules based on digital radiography (X‐ray) inspection, thermal inspection, automated‐optical inspection and acoustic inspection have been integrated to form a combined inspection system. Findings A proof in principle in‐line PCB inspection system, utilising four different inspection techniques, has been developed and demonstrated. The system is based on a generic mechanical, electrical and software communications platform culminating in a flexible system that enables the inspection modules to be used separately, together or interchanged to give the best results in terms of inspection coverage and inspection throughput. Research limitations/implications In its current embodiment, the prototype is suited to inspection of high‐return PCBs, particularly those used in medical and aerospace products, rather than high‐throughput PCB production work. The X‐ray inspection module is the slowest inspection technique and combining four different inspection techniques reduces the inspection throughput of the whole system to that of the X‐ray inspection module. Further, trials and investigations need to be carried out to improve inspection throughput. Originality/value The novelty of the system is that it is the first time that four inspection techniques have been combined to give the capability of 100 per cent defect coverage.
Automated optical inspection
Automated X-ray inspection
Visual inspection
Software inspection
Line (geometry)
Production line
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Visual inspection
Automated optical inspection
Surface-mount technology
Automated X-ray inspection
SMT placement equipment
Identification
Electronic component
Machine Vision
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In print circuit board assembly production cspecially small volume high mixed pi-ocess. solder joint visual inspection process is one of the most difficult process to be automated and it was very late to be done. We have built an automatic solder joint visual inspection system including an automatic inspection programming systcin linked with our CAD/CAM system through LAN(Loca1 Area Network). In this paper, system configuration of the automatic solder joint visual inspection system, results of inspection quality improvement experiment performed with a simulation system crcatcd by oursclvcs and also a way for increasing efficiency of using the inspection system will be ci I-ibccl. Results showed one of the most successful automatic solder joint visual inspection system for small volume high mixed surface mount printed circuit board
Automated optical inspection
Surface-mount technology
Visual inspection
Automated X-ray inspection
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With the development of the micro-electronic industry, surface mount devices (SMD) on the printed circuit board (PCB) become more and more micro size and its mounted density is increasing. It is out of date to depend on manual inspection to assure the joints quality. Instead, automated optical inspection (AOI) for solder joints based on the machine vision has become more and more important. NI Vision with the advance of flexibility and multipurpose has been a leader in machine vision and image processing. This paper proposed the devices and method to develop the AOI system for surface mount devices (SMD) with NI Vision and the inspection result is given and discussed.
Automated optical inspection
Surface-mount technology
Mount
Machine Vision
Automated X-ray inspection
SMT placement equipment
Visual inspection
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Machine vision technology has permeated many areas of industry, and automated inspection systems are playing increasingly important roles in many production processes. Electronic manufacturing is a good example of the integration of vision based feedback in manufacturing and the assembly of surface mount PCBs is typical of the technology involved. There are opportunities to use machine vision during different stages of the surface mount process. The problem in the inspection of solder joints on surface mount printed circuit board is much more difficult than many other inspection problems.
In this thesis, an approach for inspecting surface mounted integrated circuits (SMICs) is presented. It is based on the variance of intensity values of pixels in an image. This method is able to cope with 4 kinds of soldering defects in SMICs.
A set of modules for the system is proposed. The computer program which performs the image processing and analyzing has been written in C. It has been linked with a number of image processing routines from MAVIS1 to perform some image processing tasks, and the result is a compact executable module which works under MS-DOS2 3.30.
Surface-mount technology
Automated optical inspection
Automated X-ray inspection
Executable
Machine Vision
SMT placement equipment
Mount
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With wide application of surface mounted technology(SMT) in printed circuit board assembly,the electronic products have higher integration,smaller components and higher assembly density,the conventional inspection can′t fulfill the assembly automation in speed and reliability.The automated optical inspection(AOI) based on machine vision can detect the defects of SMT rapidly and accurately.The principles of AOI technology are introduced.The advantages of AOI in the SMT are proposed through an analysis on the positions which AOI should be set during the process of technology,final goals,and an example used during the working procedure of SMT.With wide application of surface mounted technology(SMT) in printed circuit board assembly,the electronic products have higher integration,smaller components and higher assembly density,the conventional inspection can′t fulfill the assembly automation in speed and reliability.The automated optical inspection(AOI) based on machine vision can detect the defects of SMT rapidly and accurately.The principles of AOI technology are introduced.The advantages of AOI in the SMT are proposed through an analysis on the positions which AOI should be set during the process of technology,final goals,and an example used during the working procedure of SMT.
Automated optical inspection
Surface-mount technology
Automated X-ray inspection
SMT placement equipment
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Citations (1)