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    A new flexible layer fabrication method for the jet deposition system to accelerate fabrication speed
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    Abstract:
    The key principle of the jet deposition rapid prototyping (RP) system is to deliver material through a jet and deposit the liquefied material onto a platform to build a physical model. Model Maker (MM) RP system is one of the jet deposition processes with the smallest slice thickness and better model accuracy. In order to maintain thinner layer thickness and model accuracy, a cutter is employed to plane off the deposited surface. The fabrication speed for MM models is extremely low because of the employment of the tiny jet and the cutting operation. The model interior filling does not affect the model accuracy very much but it does significantly affect the fabrication speed. Hence, a new flexible layer fabrication method is proposed in this paper to separate the fabrication processes of the profile and the interior, respectively, in order to maintain model accuracy and thinner slice thickness, and to accelerate the fabrication speed.
    Keywords:
    Rapid Prototyping
    Deposition
    In order to investigate the effect of hot-press fabrication parameters on mechanical properties of Al2O3 ceramic tool materials, the orthogonal experiment method was used. In the experiments, the three influence factors such as the fabrication temperature, pressure and duration time are considered. The experimental results are analyzed by a range analysis of orthogonal experiments. It is shown that the most important factor that affects the mechanical properties is the fabrication temperature and the followed factors are the fabrication pressure and the duration time of fabrication. Scanning electron microscope (SEM) reveals that the hot-press fabrication parameters will significantly affect the microstructure of ceramic tool materials, which can govern the mechanical properties. This has been validated by the orthogonal experiments in the present paper.
    It may be more cost‐effective to produce larger diameter silicon CZ solar cells. However, greater thickness is anticipated to be necessary for larger diameter wafers to withstand wafering, cell processing, and handling. No means of quantifying this anticipated thickness increase is available to provide standards or guide for cell manufacturers. In this paper equations relating wafer thickness and diameter were derived by using fracture mechanics analysis. An analytical model was used as a guideline to estimate minimum silicon wafer thickness vs. diameter requirements for ID wafering in terms of fracture mechanics parameters. The model also indicated the minimum wafer side support required for various wafer thickness at any diameter.
    Citations (8)
    Fabrication devices often appear as "large, clunky cubes", and the more capable a machine is, the larger it usually is as well. Minus 1D Fabrication investigates decoupling the output dimensions of fabrication machines from the form factor of the machines themselves. We propose designs for pen-shaped laser cutters and book-sized 3D printers, including designs that can increase the build volume without increasing the size of the machine. The resulting form factors assist the integration of fabrication into daily life.
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    In the last few years new fabrication methods, called rapid prototyping (RP) techniques, have been developed for the fabrication of hydroxyapatite scaffolds for bone substitutes or tissue engineering applications. With this generative fabrication technology an individual tailoring of the scaffold characteristics can be realised. In this work two RP techniques, a direct (dispense-plotting) and an indirect one (negative mould technique), are described by means of fabricating hydroxyapatite (HA) scaffolds for bone substitutes or bone tissue engineering. The produced scaffolds were characterised, mainly regarding their pore and strut characteristics. By these data the performance of the two fabrication techniques was compared. Dispense-plotting turned out to be the faster technique while the negative mould method was better suited for the fabrication of exact pore and strut geometries.
    Rapid Prototyping
    In the heat treatment of silicon wafer, temperature control of the wafer surface is very important. This paper investigates the rapid radiative heating characteristics of the silicon wafers arranged in a row in the vertical heating furnace by the experiment and the numerical simulation. In present test, a wafer pitch was changed from 54 mm to 216 mm. The results showed that the maximum difference of surface temperature decreased with increase of a pitch of the silicon wafer. The maximum temperature difference was about 5℃, when a wafer pitch was 108mm and ramp-up ratio was 150℃/min. Simulation and experimental result agreed very well.
    Stereolithography is a novel fabrication process based on and developed by layer manufacturing,and the fabrication time of the prototyping parts is one of the key issues during manufacturing.The time mainly comprises of two parts,one is the scanning time to cure liquid resin,and the other is the auxiliary time to assure normal fabrication process whose decrease helps to the shortening fabrication time.The choice of the fabrication direction is another main influence factor,and suitable direction can cut down the time greatly.The scanning parameters affects the fabrication efficiency and large hatch space is going to shorten the reciprocating distance during the scanning,attaining the aim to reduce the prototyping time.
    Stereolithography
    Rapid Prototyping
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    In the silicon wafer polishing process, the mounting of wafer on the polishing head could be greatly influential in final quality of finished wafers. This paper focuses on the waxless wafer mounting technique which could replace the traditional wax wafer mounting. Mounting of wafers on the carrier block using a wetted porous template provides a simple way of securing wafer on polishing head for precision wafer polishing. Demounting of wafers from the porous pad is carried out by using the water jet impingement which takes only a couple of seconds for wafer demounting. A series of wafer polishing tests of 8 inch silicon wafers using the present wafer mounting system found that the developed waxless wafer mounting could be quite suitable for producing the wafers of the excellent surface qualities by meeting industry standard such as SBIR, LLS, and production yield.
    Wafer backgrinding
    Chemical Mechanical Planarization
    Die preparation
    Today a remaining challenge is to determine the structural defect density (SDD) on a whole 156 x 156 mm2 multicrystalline (mc) silicon wafer over a timescale of a few minutes. In this contribution a new method is introduced to determine the SDD on large scale mc-Si wafers. The main advantage of the method presented is the possibility to obtain a complete map of the SDD of a 156 x 156 mm2 mc-Si wafer as well as a quantitative SDD analysis of the wafer in just a few minutes. Furthermore, the simple and quick sample preparation as well as the application of standard measurement equipment results in a convenient and cost-effective analysis tool. With these advantages, analysis of SDDs on large quantities of wafers, e.g. across the ingot height or width, can be easily realized in a few hours.
    Ingot
    Wafer-scale integration