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ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
2015
Joyeeta Nag
Brian A. Cohen
Samuel Choi
Atsushi Ogino
Minseok Oh
Yan Yan
Jim Liang
Cathryn Christiansen
Andrew Kim
Baozhen Li
Patrick W. DeHaven
Anita Madan
Siddarth A. Krishnan
Andrew H. Simon
Keywords:
Electronic engineering
Artificial intelligence
Contact resistance
Psychology
Engineering physics
Materials science
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