Heat dispersion structure and method of thin film capacitor

The present invention discloses a heat dissipating structure and method of a thin film capacitor, the film capacitor comprises a film core, the positive and negative busbar is connected to the end face of the core of the film, thin film core and a busbar provided in a closed plastic enclosure , are in contact with the bottom surface of the busbar and the cooling plate from the plastic housing is formed an epitaxial extending portion, the extension portion in contact with the cooling plate, or the core film and the busbar provided in a bottom opening of the plastic housing, directly or by extending busbar there is provided an insulating sheet between the epitaxial portion in contact with the cooling plate, in contact with the cooling plate busbars formed. The present invention is based on the original size to ensure that a thin film capacitor on the inside of the female rows extending, insulating paper passed through the cooling plate in contact with the heat dissipation, thus greatly reducing the thermal resistance of the film capacitor, completely solve the problem of the heat dissipation film capacitor, thereby extending its service life.