The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoparticles and These Bonding Mechanisms

A novel bonding process using Ag metallo-organic nanoparticles has been proposed. This process is applicable to the alternative to the current high temperature solders, such as Pb-10Sn or Pb-20Sn. In this paper, Al, Ti, Ni, Cu, Ag and Au disc joints were made using the Ag metallo-organic nanoparticles in order to investigate the bondability of the various metals. These joints were evaluated based on the measurement of the shear strength, and the observation of the fracture surfaces and the cross-sectional microstructures. The shear strength of various metal joints increased in the following order: Al, Ti, Ni, Cu, Ag and Au joints. This corresponds to the order of the standard free energy value of the oxide formation for each metal. This result suggests that the carbon atoms generated by the decomposition of the organic shell of the Ag metallo-organic nanoparticles may play a role in deoxidizing the oxide film on the metal surface.Copyright © 2005 by ASME