Magnetron sputtering of cocr/cr and cocata/cr on flexible substrates

In this paper a new method is developed to deposit magnetic films on flexible substrates. The magnetron sputter process commonly used in hard disk technology is adapted to the specific needs of flexible substrates. By using a higher sputter pressure and no substrate heating the problem of substrate stress or deformation is solved. The influence of all major sputter parameters is discussed in this article. All samples mere characterized by magnetic measurements [hysteresis curve (H/sub c/, M/sub r/, M/sub s/), remanence and /spl delta/M measurements], and by XRD and AFM.