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A New Method to Induce Local Tensile Strain in SOI Wafers: First Strain Results of the "BOX Creep" Technique
A New Method to Induce Local Tensile Strain in SOI Wafers: First Strain Results of the "BOX Creep" Technique
2015
A. Bonnevialle
C. Le Royer
Y. Morand
S. Reboh
J.M. Pedini
A. Roule
D. Marseilhan
P. Besson
D. Rouchon
N. Bernier
C. Tabone
C. Plantier
L. Grenouillet
M. Vinet
Keywords:
Silicon on insulator
Creep
Wafer
Composite material
Ultimate tensile strength
Materials science
Strain (chemistry)
tensile strain
Correction
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