SPUTTERING TARGET COMPRISING Ni-P ALLOY OR Ni-Pt-P ALLOY AND PRODUCTION METHOD THEREFOR

Provided is a production method for a Ni-P alloy sputtering target, said production method being characterized in that: a Ni-P alloy that comprises 15-21 wt% of P and a remainder of Ni and unavoidable impurities is melted, the result is atomized in order to prepare a Ni-P alloy atomized powder having an average particle size of 100 µm or less, pure Ni atomized powder is subsequently mixed with the Ni-P alloy atomized powder, and the result is hot pressed. The present invention addresses the problem of providing a production method for a Ni-P alloy sputtering target in which deviation from a target composition is small.