3D TSV system in package (SiP) for aerospace applications

In the frame of its future needs for aerospace market, Sagem has designed a 3D electronic function based on a TSV silicon interposer from IPDiA. This paper deals with motivations and technologies retained to give Sagem opportunities to integrate "downscaling features" in future aerospace equipment's electronic. Saving space and weight are critical objectives for aerospace equipment's due to nowadays fast growing energy prices. On each project we are involved on, we need to have in mind that each extra kilogram coming from our equipment is a direct loss in term of revenues for our customers. However, increasing power density in such a way needs to be carefully done, managing also thermal and cost aspects. In this way a silicon TSV interposer was chosen to design and manufacture a system in package for aeronautic applications. This paper will describe all aspects of the SiP project that involved designers in the frame of aerospace applications. Second part will describe SiP technology and how we plan to test and use this component on electronic boards.