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E. Bailly
E. Bailly
SAGEM
Manufacturing engineering
System in package
Interposer
Cost aspects
Aerospace
2
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6
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3D TSV system in package (SiP) for aerospace applications
2013
EMPC | European Microelectronics and Packaging Conference
J. C. Riou
E. Bailly
Catherine Bunel
L. Lenoir
M. Pommier
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Citations (3)
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