A sputtering apparatus and a substrate processing apparatus

A sputtering apparatus, said sputtering apparatus includes a chamber, can be held in the chamber surrounding the substrate holder and the substrate holder rotational axis perpendicular to the surface of the substrate, the first to fourth target holder, shielding means, and a transfer gate through which the substrate. The first to the fourth targets disposed in a holder member having a long and short sides and in contact with the center axis of said virtual circle imaginary rectangle vertices, the first target and the second holding member holding the target member are arranged on the vertices of an imaginary rectangle defining two shorter sides a, a first target holder and the target holder member and the second valve member to a third distance is less than the target holder and the target holder member to the fourth valve distance.