THE TEST-TO-TARGET METHODOLOGIES FOR THE RISK ASSESSMENT OF SEMICONDUCTOR RELIABILITY

Traditionally, to assess reliability lifetimes and to evaluate reliability performance of semiconductor devices and chips, we test the samples to their failures. This can be called the "Test-to-Fail" scenario, which usually takes a long time (e.g., longer than a week). The Test-to-Failure scenario is required especially at the qualification stage, whose objective is to obtain the lifetimes of, e.g., devices, dielectrics, and metal lines. Due to the long test times, this approach is inadequate for reliability monitors, which need to be completed in a much shorter period of time so the product shipment will not be delayed and, if failed, timely corrective actions can be taken. Therefore, we are in urgent need of a much more efficient method to judge if the monitor meets reliability requirements. The "Test-to-Target" reliability test methodology perfectly matches such demand by only stressing the samples to much shorter times and can be applied on most common reliability tests like NBTI (Negative Bias Temperature Instabilities), HCI (Hot Carrier Injection), TDDB (Time Dependent Dielectric Breakdown), Isothermal EM test, and IMD (Inter Metal Dielectric) Vramp test. The corresponding specs for the Test-to-Target approach are defined based on the baseline records from the former complete Test-to-Fail reliability tests. From practical exercises after a long time, we prove the Test-to-Target methodology a truly useful approach particularly effective for reliability monitors, inline reliability assessments, process change management, nonconformance dispositions, and tool releases.