Design and verification of 160 × 120 bolometer ROIC

A 160 × 120 bolometer uncooled infrared read out circuit (ROIC) and detector equivalent model were presented. The SPICE simulation model was based on the relationship between micro-bolometer material thermal parameters and electrical parameters. Blind pixel compensation technique was used in the ROIC to suppress self-heating effect. As the main part of the ROIC, capacitive transimpedance amplifier (CTIA) was used to integrate detector current, and selectable integration capacitors were used to extent dynamic range. Connecting with digital timing circuit, a 160×120 micro-bolometer ROIC was designed and manufactured by CSMC 0.5um DPTM CMOS process. The test results were the output swing of the chip was 2.6V and the typical power dissipation was 96mW, so the chip is very suitable for portable devices.