Process for producing a high-purity copper powder with thermal plasma

The present invention relates to a process for producing high-purity copper (Cu) powder material used for manufacturing and through stator liner sputtering target material in the electronics industry. Raw material supply unit, the plasma torch unit, and a method for producing a metal powder by using a device comprising a reaction vessel, thermal plasma copper (Cu) powder having an average particle diameter of 30~450μm in 2~30kg / hr infusion rate by passing the torch to obtain a high-purity copper powder having an average grain size of 5 to 300 .mu.m.