Hafnium oxide thin films deposited by high pressure reactive sputtering in atmosphere formed with different Ar/O2 ratios

Abstract The physical and electrical properties of hafnium oxide (HfO 2 ) thin films deposited by high pressure reactive sputtering (HPRS) have been studied as a function of the Ar/O 2 ratio in the sputtering gas mixture. Transmission electron microscopy shows that the HfO 2 films are polycrystalline, except the films deposited in pure Ar, which are amorphous. According to heavy ion elastic recoil detection analysis, the films deposited without using O 2 are stoichiometric, which means that the composition of the HfO 2 target is conserved in the deposition films. The use of O 2 for reactive sputtering results in slightly oxygen-rich films. Metal-Oxide-Semiconductor (MOS) devices were fabricated to determine the deposited HfO 2 dielectric constant and the trap density at the HfO 2 /Si interface ( D it ) using the high–low frequency capacitance method. Poor capacitance–voltage ( CV ) characteristics and high values of D it are observed in the polycrystalline HfO 2 films. However, a great improvement of the electrical properties was observed in the amorphous HfO 2 films, showing dielectric constant values close to 17 and a minimum D it of 2×10 11  eV −1  cm −2 .