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3D stacked IC demonstration using a through silicon via first approach
3D stacked IC demonstration using a through silicon via first approach
2011
J. Van Olmen
Abdelkarim Mercha
G. Katti
Cedric Huyghebaert
J. Van Aelst
E. Seppala
Zhao Chao
Silvia Armini
Jan Vaes
R. Teixeira Cotrin
M. van Cauwenberghe
Patrick Verdonck
K. Verhemeldonck
Anne Jourdain
Wouter Ruythooren
M. de Potter de ten Broeck
Ann Opdebeeck
T. Chiarella
B. Parvais
Ingrid Debusschere
T. Y. Hoffmann
Michele Stucchi
M. Rakowski
Ph. Soussan
R. Cartuyvels
Eric Beyne
S. Biesemans
Bart Swinnen
Wim Dehaene
Keywords:
Materials science
Through-silicon via
Optoelectronics
Correction
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