A study of the limited area scanning system in the mask CD-SEM
2008
Measurement of resist critical dimensions (CDs) utilizing a scanning electron microscope (SEM)
based metrology system causes the resist to change due to irradiation effects of the electrons. A new
and novel scanning approach has been developed in an effort to minimize the effects electron
irradiation and exposure during the measurement process. This technique is especially pertinent in
view of the tightening requirements for process control to achieve single digit CD uniformity on
leading edge photo masks being produced today. The measurement of OPC features necessitates
utilization of SEM based metrology due to resolution requirements, but the effects of high
magnification imaging presents unique challenges. By controlling the scanned region of interest
(ROI) it is possible to reduce exposure and irradiation effects. This paper will detail this new
approach as it is utilized on the LWM9045 SEM Metrology system. The LWM9000SEM mask CD
SEM was introduced earlier.
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