Testing for the Characteristic of Vacuum Microelectronic Silicon Tip Array-sensitive Thin Film Compounded Cathode Pressure Sensor

The package and testing of a vacuum microelectronic silicon tip array-sensitive thin film compounded cathode pressure sensor are reported. Based on the simulative calculations, a testing of a packaged vacuum microelectronic pressure sensor is accomplished. Both the curves of the pressure(varing by linearity and is resemble with the simulation, emitting current reaches to 86mA when the voltage is 45V, each tip on average is 21μA) and the field induced current (unlock voltage is 1.5V, is congruous with the simulation) and the data of the sensitivity(0.3μA/kPa ) are required.