Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI

Due to the advancement of CMOS image sensors (CIS), camera module on the mobile platform has paved way for very high quality photos and video shooting capability. In order to improve picture quality, the CIS technology has been also scaling aggressively to provide more Mega-Pixels (MP) but it also must be less susceptible and immune to noise sources, particle and defect-free, and highly reliable. In this report, we'll discuss the reliability characterization done on the 3D stack sensor with in-pixel DTI. By optimization of both process and design, noise immune and very high quality advanced CIS products have been successfully qualified and manufactured for volume production.