Three‐dimensional design in electron‐beam lithography

A technology for micro/nanostructuring of surfaces based on one‐step direct electron‐beam lithography, plasma‐chemical etching, and electrochemical deposition is developed. The key operation for three‐dimensional (3D) design is 3D dose correction. It allows one to create structures in organic resist on a substrate with a predefined profile with vertical sizes in the range of 50 nm–5 μm and with 50–1 mm dimensions in the lateral direction. Metal replicas were created by electrochemical deposition. The replicas were used then as a stamp for fast transferring of the relief into a soft material (polymer). We expect the application of this process in optoelectronics, optical processing, creation of zone plates, and other diffractive optical elements (calculated holograms).