Fan-out interconnect structure and method of forming

The present invention discloses a method comprising forming a sacrificial layer on a top surface of the die, the die having a contact pad on the top surface. The die bonding to the carrier, and the molding compound and the die is formed over the sacrificial layer. Plastic molding extending along the side walls of the die. Exposing the sacrifice layer. By removing the sacrificial layer to expose at least a portion of the contact pad. The first polymer layer is formed over the die, and a redistribution layer (RDL) is formed over the die and electrically connected to the contact pad. The present invention also discloses a fan-out interconnect structure and forming method.