Tantalum coil obtained by the reproduction method and the regeneration method of the sputtering tantalum coil

[Abstract] A method of reproducing sputtering tantalum coil disposed between the substrate and the sputtering target, by cutting the coil entirely or partially spent tantalum coil eliminates one side pull (redeposition film and knurling marks until cutting) that removes the redeposition layer formed during the sputtering, then cutting the portion, to a method of reproducing sputtering tantalum coil, characterized in applying a new knurling. During sputtering, sputtered particles deposited on the surface of the tantalum coil disposed between the substrate and the sputtering target (redeposition), but, after the end of the sputtering, the sputtered particles deposited this spent coil is removed by cutting , which reproduces a tantalum coil efficiently, thereby eliminating the waste of making new coil, increase productivity, and to provide a technique that can be provided by the same coil stable. .FIELD 1