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Chip-Package-Board Codesign of Highly Linear 3G-CDMA Upconverter Modules
Chip-Package-Board Codesign of Highly Linear 3G-CDMA Upconverter Modules
2005
F.-Y. Han
J.M. Wu
Tzyy-Sheng Horng
C. C. Tu
R. Chen
C.H. Chu
Keywords:
Materials science
Heterojunction bipolar transistor
Electronic engineering
Linearity
Code division multiple access
Chip
Indium gallium arsenide
Electrical engineering
Radio frequency
Correction
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