New Ternary Copper–Nickel Alloys with Refractory Elements for Epitaxial Substrates

The quality of the crystallographic texture is analyzed for thin ribbons made of ternary Cu–40% Ni–Me (Me = Nb, Mo, or W) alloys, which are promising materials for epitaxial substrates. Optimal regimes of recrystallization annealing of ~100-μm-thick ribbons made of these alloys are determined, which provide perfect cubic texture with a fraction of {001}〈100〉 grains of more than 96%. The proposed alloys are paramagnetic at operating temperatures of a high-temperature superconductor and less expensive than the nickel ones; therefore, they may be an alternative to the Ni–4.8 at % W alloy, which is most popular in the production of ribbon substrates.