Copper slag slowly-cooling treatment technology

The invention provides a copper slag slowly-cooling treatment technology which sequentially comprises the following steps: A, slag receiving, to be specific, transporting slag ladles to the part below a furnace to receive liquid copper slag; B, air-cooling, to be specific, transporting the slag ladles to the outside, enabling the copper slag and the slag ladles to be cooled in air, and enabling the temperature of the copper slag in the slag ladles to be slowly reduced from 1250 DEG C to 1000 DEG C; C, spraying, to be specific, spraying water to the copper slag and the slag ladles for cooling; D, deslagging, to be specific, when the temperature of the outer walls of the slag ladles is smaller than 50 DEG C, pouring away the copper slag in the slag ladles; E, smashing, to be specific, enabling the copper slag to be subjected to three-level smashing; F, ball-milling, to be specific, ball-milling and grading the smashed copper slag, so as to obtain crude slag powder and qualified fine slag powder; G, flotation, to be specific, performing flotation on the qualified fine slag powder, so as to obtain copper concentrate powder and tailings; H, magnetic separation, to be specific, performing magnetic separation on the tailings produced after flotation, so as to obtain iron concentrate powder. In the copper slag slowly-cooling treatment technology, the liquid copper slag is fully and slowly cooled, and the agglomeration and growth of copper particles in the liquid copper slag are facilitated, so that the copper recovery rate is increased.