Old Web
English
Sign In
Acemap
>
Paper
>
A highly reliable Cu interconnect with CuSiN and Ti-based barrier metal: Impact of oxgen surface treatment
A highly reliable Cu interconnect with CuSiN and Ti-based barrier metal: Impact of oxgen surface treatment
2011
Hayashi Yumi
Matsunaga Noriaki
Wada Makoto
Nakao Shinichi
Watanabe Kei
Kato Satoshi
Sakata Atsuko
Kajita Akihiro
Shibata Hideki
Keywords:
Electromigration
Metallurgy
Metal
Materials science
Interconnection
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]