Thermoelectric module and manufacturing method thereof

Disclosed is a thermoelectric module which adopts a bonding technology enabling a thermoelectric module to be stably driven even at a high temperature, and a method for manufacturing the same. A thermoelectric module according to the present invention comprises: a plurality of thermoelectric elements each consisting of a thermoelectric semiconductor; an electrode which is made of a metal material and is connected between the thermoelectric elements; and a bonding layer which comprises a metal compound consisting of two or more metals, as a sintered body of a paste, interposed between the thermoelectric element and the electrode, which bonds the thermoelectric element and the electrode and comprises the two or more kinds of metal powders.