Low-loss GeO2 thin films deposited by ion-assisted alternating current reactive sputtering for waveguide applications

Abstract We report low optical loss germanium oxide (GeO2) thin films which have been deposited by low pressure ion-assisted dual alternating current sputtering of germanium targets in an oxygen plasma environment. The germanium oxide films ranging from 0.7- to 1.0-µm-thick were fabricated at low temperature and high deposition rates of 6–38 nm/min on silicon and thermally oxidized silicon substrates. The refractive index of the films was determined through variable angle spectroscopic ellipsometry and found to be 1.6051 on average at a wavelength of 638 nm. The films were shown to be near stoichiometric through Rutherford backscattering spectroscopy analysis and displayed sub-nanometer roughness when measured with atomic force microscopy. High peak-to-valley uniformity on a 3-inch substrate with relative deviation of 0.8% was achieved. We characterized the attenuation of the GeO2 thin films from visible to near-infrared wavelengths and observed it to be as low as 0.1 dB/cm at 638 nm for deposition rates of 8 nm/min. This deposition technique provides complementary metal-oxide-semiconductor compatible GeO2 thin films suitable for integrated photonics applications and is promising for the fabrication of other dielectric waveguide materials.