A process for producing a semiconductor device having a dielectric structure

A dielectric layer is deposited on a work surface of a substrate, wherein the dielectric layer comprises a dielectric polymer or consists thereof. The dielectric layer is partially cured. A part of the partially cured dielectric layer is removed by a chemical mechanical polishing process. Then the curing of the remaining parts of the partially cured dielectric layer is continued to form a dielectric structure. The partially cured dielectric layer has high Abtragrateen during chemical mechanical polishing. With the remaining parts of the dielectric layer are provided in cavities, structures with good insulation volume can be created in an efficient manner.