Semiconductor chip packaging structure and manufacturing method thereof

The invention provides a semiconductor chip packaging structure and a manufacturing method thereof. The method comprises the steps as follows: a plurality of electrodes which are arranged at intervals are formed on a semiconductor substrate; a sputtering conductive layer covering the semiconductor substrate and the electrodes is formed; an insulating protection layer is formed on the sputtering conductive layer outside the electrodes; the insulating protection layer comprises a first insulating protection block and a second insulating protection blocks, which are arranged at two sides of each electrode respectively; a metal layer and a soldering tin layer are sequentially formed on the sputtering conductive layer between each first insulating protection block and the corresponding second insulating protection block; and the sputtering conductive layer outside the first insulating protection blocks and the second insulating protection blocks is etched. In the manner, the undercut defect between the sputtering conductive layer and each metal layer can be avoided; the contact area of the sputtering conductive layer and each metal layer is increased; soldering tin is prevented from being injected into the sputtering conductive layer to form a mesoporous metal compound, so that the stability and the reliability of the semiconductor chip packaging structure are improved.